IPA Defines Data-Sharing Requirements for Stable Automotive Semiconductor Supply

Overview

The Information-technology Promotion Agency, Japan (IPA) published the Guidelines on Data-Sharing Mechanisms for Supply Chain Resilience (Automotive Semiconductor Related), Version 0.1, on June 16, 2026. The guidelines define requirements for companies to share semiconductor part numbers and specifications, end-of-sale information, recommended and non-recommended information concerning generational replacement, production locations, and other data within the scope specified by data providers. They present a mechanism that enables automotive OEMs and parts manufacturers to accelerate alternative-product evaluations and production-plan adjustments. Going forward, the initiative will gradually expand to general-purpose semiconductors and other industries while advancing detailed design and platform operations.

This summary was automatically generated by AI. Please refer to the original article for accuracy.

Key points

  • IPA published Version 0.1 of the data-sharing guidelines for automotive semiconductors.
  • Companies can share information concerning supply outlooks within the necessary scope.
  • The initiative accelerates alternative-product evaluations and production-plan adjustments, promoting supply-chain resilience.
  • The initiative will gradually expand its application to general-purpose semiconductors and industries beyond the automotive sector.

Overview

Manufacturing supply chains have become globalized and more complex, making their outlook harder to predict because of infectious disease outbreaks, natural disasters, regulations in various countries, and geopolitical risks. In semiconductors as well, tight supply and shortages make the supply-demand balance difficult to forecast, requiring procurement organizations to understand available supply and lead times and connect that knowledge to alternative sourcing and decision-making.

For suppliers, it has become important not only to plan production and inventory placement in light of demand fluctuations and constraints, but also to present the outlook for product lineups systematically. The IPA Digital Architecture and Design Center (DADC) is advancing an initiative that uses data spaces to address these challenges and published this document as part of that effort.

IPA published Version 0.1 of the guidelines covering automotive semiconductors on June 16, 2026.

Key figures

Publication date
June 16, 2026
Public comment period
From April 2, 2026 to May 7, 2026
Guideline version
0.1 edition
Fiscal year of demonstration project
Reiwa 7 fiscal year

Impact

Automotive OEMs and parts manufacturers will be able to consult supply-related information from companies with which they have no direct business relationship, within the necessary scope, making it easier to select and switch products based on technological developments and trends.

Semiconductor manufacturers can efficiently share information related to supply outlooks while retaining their trade secrets. This supports decision-making amid uncertain conditions for information sharing between companies and contributes to diversified procurement sources and improved responsiveness across the supply chain.

The initiative is expected to promote appropriate product selection and switching and contribute to strengthening the competitiveness of related industries, including the automotive industry, through the stable supply of semiconductors.

Details

The guidelines define business and functional requirements for linking and using data between companies regardless of whether they have a direct business relationship. Data-space participants consult information within the access-control scope established by data providers, based on trust established under contracts with the operating organization.

On the covered semiconductor data platform, semiconductor manufacturers register information, while automotive OEMs and parts manufacturers consult it within the necessary scope. The information includes part numbers and specifications, EOL (end-of-sale) information, recommended and non-recommended information encouraging generational replacement, and production-location information related to supply capacity.

Providers can specify and control the recipients and data items disclosed. The document compiles demonstration results from the initiative to build a data-sharing platform for semiconductor and other automotive-parts supply chains under the Ministry of Economy, Trade and Industry's Demonstration and Support Project for CASE, Including Automated Driving Without Operators.

Version 0.1 addresses conceptual design for automotive semiconductors. Going forward, its scope and content will gradually expand to general-purpose semiconductors, industries beyond the automotive sector, detailed design, and platform operations. Before publication, the results of public comments submitted from April 2, 2026 to May 7, 2026 were incorporated.

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